Senior Packaging Engineer

The role

You will lead IC packaging initiatives from conceptualization and design to manufacturing process selection. You will establish the supply chain, manage sub-contractors, and oversee NPI and ramp-up phases for Arago devices.

What you will do

• Design packaging solutions spanning from initial drawings and simulations to DFM.
• Identify, vet, and manage external sub-contractors.
• Collaborate cross-functionally with IC design, optical, and PCB teams to align packaging specifications across domains.
• Lead the chip industrialization process, ensuring high yield and Cpk.
• Conduct thorough failure analysis and debugging.

Required qualifications

• Master's degree in Electrical Engineering or Integrated Circuits Design.
• 5+ years of experience in the semiconductor and photonic packaging industry.
• Proficiency in heterogeneous integration and packaging processes, including wafer dicing (stealth, blade, diamond scribing), high-density Cu pillars and advanced bumping, flip-chip, redistribution lay
• Strong expertise in photonic and optoelectronic packaging and micro-scale optical alignment, including passive and active alignment of lenses and optical fibers, fine die placement (precision < 1µm),
• Proficiency in thermal, mechanical, and EM simulations.
• English at a proficient level.

Nice to have

• Strong understanding of packaging industrialization, production flows, high-yield and scale manufacturing, failure analysis, and Six Sigma methodology
• French

Benefits

• Competitive cash compensation
• Meaningful stock option plan
• Relocation bonus and coverage of moving expenses for relocation within 20 minutes of the company’s location
• Healthcare coverage (including family-friendly options)
• Pension contributions
• Professional development support
• 25 days of PTO, in addition to public holidays
• Ownership of a key technical domain
• Reimbursement of 50% of the public transport subscription fee

About the company

Arago is an AI and computer hardware company whose mission is to drive the course of history forward by accelerating breakthroughs at the intersection of AI and semiconductors. Founded in 2024, it brings together a lean team of engineers and scientists.