Advanced Packaging & Integration Lead

The role

This person will develop packaging solutions for multi-chip silicon spin-qubit devices within a scalable quantum system. You will drive the R&D of complex multi-chip modules using TSVs and micro-bumps optimized for millikelvin temperatures.

What you will do

• Drive high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules.
• Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding.
• Ensure packaging architectures and interconnects withstand thermal cycling down to the millikelvin regime.
• Contribute to early-stage architecture and co-design activities.
• Develop simulation approaches to evaluate packaging and process options at DC and RF frequencies.
• Balance R&D execution with yield improvement, failure analysis, manufacturability, and hardware reliability.
• Own technical activities with external suppliers, OSATs, and research partners.
• Support the transfer of novel packaging designs into external manufacturing and advanced packaging lines.

Required qualifications

• Master’s or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field.
• 7+ years’ experience in 3D integration and advanced packaging, including TSVs, fine-pitch micro-bumps, and flip-chip bonding.
• Experience with 3D-IC layout, planning, and simulation platforms for multi-die co-design, TSV floorplanning, and vertical interconnect planning.
• Experience with multi-physics analysis tools such as Ansys HFSS/Q3D or equivalent for signal/power integrity, RF analysis, and cryogenic structural/thermal stress.
• Experience managing technical transfers and working closely with external semiconductor advanced packaging facilities, OSATs, or research partners.
• Proven ability to guide technical strategy and work effectively across multidisciplinary engineering teams.

Nice to have

• Experience with cryogenic electronics, semiconductor physics, or silicon spin qubits.
• Knowledge of material behaviour at extreme temperatures, including superconductors and low-loss dielectrics.
• Experience leading or mentoring engineers in a high-tech, fast-paced R&D environment.

About the company

equal1 is seeking an Advanced Packaging & Integration Lead to develop packaging solutions for multi-chip silicon spin-qubit devices.