Advanced Packaging SI/PI Engineer

The role

You will be responsible for the electrical performance of an AI accelerator platform across silicon, package, and board. You will work with silicon, package, platform, and system teams to co-design platforms with OSAT and ODM partners.

What you will do

• SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
• Interaction with Package Layout Designers, ASIC PD and IP teams and Board teams to optimize electrical performance
• Drive SI requirements into interposer/substrate layout from preliminary design through tape-out
• Drive PDN design and decoupling strategy across substrate and interposer
• Own ball map / C4 / BGA pin assignment from soft freeze through final freeze
• Support board-level SI/PI and rack-level scale-up topology studies
• Participate in cross-functional meetings and design reviews

Required qualifications

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field
• 8+ years of SI/PI experience on high-performance ASIC, processor, or accelerator platforms
• Proven experience defining and closing PDN for high-power silicon
• Experience with developing systems with high-speed interfaces like HBM, SerDes and D2D interfaces
• Hands-on expertise with one or more of: ANSYS HFSS / SIwave, Cadence Sigrity (PowerSI / PowerDC), Keysight ADS
• Experience with CoWoS or equivalent advanced packaging materials and technologies
• Track record of designing and correlating SI/PI test vehicles against silicon measurement
• Strong analytical and communication skills

Nice to have

• Familiarity with full RTL-to-GDSII context
• Experience with multi-die, 2.5D, or 3D packaging signoff
• Project management experience coordinating across internal teams, OSAT partners, and PCB ODMs
• Familiarity with modern ML and LLM model architectures, accelerator architectures, or HPC system design
• Startup experience or comfort working in fast-paced environments

Benefits

• Medical, dental, and vision packages with generous premium coverage
• $500 per month credit for waiving medical benefits
• Housing subsidy of $2.5k per month for those living within walking distance of the office
• Relocation support for those moving to San Jose (Santana Row)
• Various wellness benefits covering fitness, mental health, and more
• Daily lunch and dinner in our office
• Unlimited compute budget subject to ROI justification

About the company

Etched is building hardware for frontier intelligence by co-designing chips, racks, software, and manufacturing. They are a fully in-person team in San Jose (Santana Row).