Etched

Substrate IC Package Layout Design Engineer (Taiwan)

Taipei. Posted a month ago

The role

You will lead the end-to-end design of complex IC substrate packages for high-power AI processors. You will work with silicon, signal integrity, power integrity, and system teams to co-design substrates with OSAT providers.

What you will do

  • Lead the design and development of complex IC substrate layouts for high-power AI processors and accelerators.
  • Design large and complex multi-layer substrate packages with high pin counts and dense routing requirements.
  • Ensure robust power delivery designs capable of supporting >700W custom silicon solutions.
  • Develop high-speed signal routing solutions capable of supporting >50GHz signaling.
  • Collaborate with SI/PI engineers to define signal integrity and power integrity requirements.
  • Optimize CoWoS interposer designs for thermal and electrical performance.
  • Work with chip design, packaging, and manufacturing teams to ensure design feasibility and manufacturability.
  • Perform DRC and LVS verification for all substrate designs.
  • Develop and maintain design documentation and guidelines.
  • Support design reviews and provide technical guidance to junior team members.

Required qualifications

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
  • 10+ years of experience in IC substrate layout design for high-performance processors or accelerators.
  • Extensive experience with large substrate packages (>50mm) and complex high-density layouts.
  • Proven experience with high-power (700W+) package designs and robust power delivery networks.
  • Expertise in high-speed signaling design (>50GHz) and mitigating signal integrity challenges.
  • Strong experience with CoWoS (Chip-on-Wafer-on-Substrate) interposer design.
  • Advanced proficiency in Allegro Package Designer.
  • Deep understanding of SI/PI principles.
  • Strong analytical skills.

Benefits

  • Competitive compensation packages
  • Generous equity packages
  • Comprehensive insurance coverage
  • Other top-of-market benefits

About the company

Etched is building hardware for frontier intelligence by co-designing chips, racks, software, and manufacturing. The company is a fully in-person team in San Jose and Taipei.

Substrate IC Package Layout Design Engineer (Taiwan) at Etched | JobZoey