Packaging Architect

The role

The Advanced Packaging Architect will own the packaging technology direction and roadmap for current and future products. This role involves leading the full development flow for the DX-1 and defining packaging strategy, partner ecosystems, and internal capabilities.

What you will do

• Own package architecture and design for ASIC-to-substrate integration
• Lead development of 2.5D and 3D package architectures
• Define package structures for electrical, thermal, mechanical, reliability, and manufacturability requirements
• Own or direct the full package design flow from concept to manufacturing support
• Develop and review package layouts including die placement and substrate routing
• Own or direct PI/SI simulation activities
• Support package-to-board co-design
• Establish packaging engineering capability including methodologies and tool flows
• Build and lead a team of packaging engineers
• Collaborate with ASIC, optics, mechanical, thermal, and systems engineers

Required qualifications

• 10+ years' experience in advanced semiconductor packaging for ASIC or other high-performance products
• Demonstrated ownership of packaging architecture, technology strategy, or roadmap development for complex products
• Deep expertise in front-end package design, including ASIC-to-substrate integration
• Strong experience with 2.5D and/or 3D package architectures, including multi-die and heterogeneous integration
• Strong hands-on capability with package design tools such as Cadence Allegro X APD, Siemens Xpedition, or equivalent
• Experience leading package development across layout, simulation, verification, and release
• Strong PI/SI simulation capability, including package-level signal integrity and power delivery analysis using tools such as Ansys SIwave, Cadence Sigrity, or equivalent
• Experience in substrate design and package-to-board integration
• Experience building packaging capability, processes, or teams, or leading engineers while remaining a hands-on contributor
• Strong working relationships with substrate vendors, OSATs, and foundry packaging organisations
• Good understanding of manufacturability, interconnect technologies, and package reliability
• Degree in a relevant engineering or physical sciences discipline

Nice to have

• Experience with AI accelerators, high-performance compute, networking, or advanced data-centre hardware
• Familiarity with wafer-level packaging and emerging advanced packaging platforms
• Exposure to optical or photonic integration with electronic packaging
• Familiarity with package reliability, qualification, and failure analysis workflows
• Exposure to new product introduction and scaling advanced package technologies into production

Benefits

• Competitive Salary
• Meaningful stock options
• Annual Living-Local Bonus if your residence is within 20 minutes of the office

About the company

OLIX is building a new paradigm for AI infrastructure to address the massive infrastructure gap. The company is developing the DX-1, the first accelerator architected specifically for decode.