Senior/Staff Process Engineer (Wafer Dicing & Back-grind)

The role

This person will develop silicon photonic wafer backside grinding, laser stealth dicing, and die sorting processes. They will optimize parameters and solve process abnormalities to improve product yield.

What you will do

• Develop silicon photonic wafer backside grinding, laser stealth dicing, and die sorting processes.
• Optimize wafer thinning thickness, grinding speed, cutting path, and laser cutting parameters.
• Solve process abnormalities including wafer warpage, surface scratch, incomplete cutting, and chip breakage.
• Monitor wafer thickness uniformity, cutting quality, and production capacity.
• Evaluate process compatibility between wafer grinding/stealth dicing and bumping and flip-chip processes.
• Compile process SOP, WI, failure reports, and engineering change documents.
• Support NPI new product introduction and process verification.

Required qualifications

• Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline.
• 3 to 6+ years of hands-on process engineering in wafer mounting, stealth dicing, wafer grinding.
• Experience handling advanced packaging wafers with more complex topology or stack.
• Experience working with external equipment and material suppliers to develop equipment and materials.
• Experience to characterize, qualify and bring the process up for mass production.
• Familiarity with SPC, JMP data analysis, and DOE matrix design.

About the company

lumilens