Senior/Staff Process Engineer (Flip Chip)

The role

This person will own the process development and technical support of the Flip Chip process for silicon photonic chip wafers. They will perform DOE to characterize process windows, evaluate raw materials, and lead reliability validations.

What you will do

• Own process development and technical support of the Flip Chip process
• Perform DOE to characterize process window and margin
• Optimize process integration with upstream processes
• Evaluate and qualify new manufacturing raw materials
• Design and execute DOE plans to characterize thermal and mechanical stress
• Lead reliability validations including TCT, HAST and HTS
• Own root-cause diagnostics of structural failure modes
• Manage incoming material quality control and establish SPC control plans
• Compile process SOP, WI, process failure reports and engineering change documents
• Support NPI new product introduction and process verification

Required qualifications

• Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline
• 5+ years of hands-on industry experience in flip chip assembly
• Deep practical understanding of plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow
• Comprehensive command of finite element simulation principles regarding warpage, thermal dissipation, and structural mechanical integrity
• Solid working expertise with industry validation methodologies including FMEA, SPC controls, and structured 8D problem-solving tools
• High proficiency with robust analytical platforms like JMP, Minitab

About the company

lumilens