Power Integrity Engineer-Silicon

The role

The Senior / Principal Power Integrity Engineer will own and drive power delivery strategies across complex 2.5D/3D packages. This role involves architecting low-noise, high-efficiency PDNs for electrical ICs, photonic ICs, chiplets, and high-bandwidth memory.

What you will do

• Define and implement power integrity architectures for 2.5D/3D heterogeneous integration.
• Perform full-stack power integrity analysis and optimization from die-level to system-level.
• Model, simulate, and validate power delivery solutions using industry-leading tools.
• Lead power integrity co-design with silicon design, package engineering, and photonics teams.
• Drive selection and qualification of advanced power components.
• Collaborate with foundry and OSAT partners on PDN process capabilities.
• Develop and refine power integrity methodologies, design rules, and sign-off criteria.
• Analyze and mitigate power-related reliability risks.
• Partner with cross-functional teams to explore emerging technologies and protect IP.
• Own power integrity qualification and lab validation.

Required qualifications

• Deep expertise in power integrity for high-performance semiconductors.
• Proven track record leading power integrity efforts in advanced packaging environments.
• Bachelor’s degree in Electrical Engineering, Physics, or related field + 10+ years relevant industry experience; or Master’s/PhD + 7+ years related experience.
• Hands-on proficiency with PI simulation tools (Ansys, Cadence/Sigrity, Keysight ADS, Apache/RedHawk, or equivalents).
• Strong understanding of chip-package-system interactions and high-speed signaling impacts on PDN.
• Demonstrated ability to lead complex, cross-functional programs across global teams, foundries, OSATs, and suppliers.
• Excellent communication, presentation, and documentation skills.

Nice to have

• Experience with power integrity in silicon photonics, CPO/NPO, photonic IC/laser integration, or high-bandwidth optical interconnects for AI accelerators.
• DTCO for 3D IC solutions
• Prior work defining long-term PDN roadmaps and executing from concept through high-volume manufacturing in hyperscale AI or HPC environments.
• Leadership in multi-supplier or multi-company power integrity initiatives.
• Familiarity with signal integrity/power integrity co-optimization, high-speed SerDes, PCIe/CXL interfaces, HBM integration, or advanced memory subsystems.
• Familiarity with photonic and electrical IC foundry processes (BICMOS, Advanced node CMOS...etc)
• Knowledge of board/system-level power delivery requirements and multi-physics considerations (thermal-electrical coupling).
• Ability to influence senior engineering leaders across silicon architecture, package design, systems, and supply chain.

About the company

Lumilens is building critical photonics infrastructure for AI supercomputing, including chip-to-chip optical interconnects and scalable photonic engines. It is a well-funded startup backed by Mayfield.