Component Process Engineer Singapore

The role

The Component Process Engineer serves as the primary substrate engineering interface between hardware design teams, package manufacturing teams, and worldwide substrate suppliers. The role focuses on FR4 substrate or PCB from new technology development and process development to qualification of the suppliers.

What you will do

• Identify, develop and qualify FR4/PCB substrate suppliers worldwide.
• Lead DFM/DFT/DFR of PCB substrates, risk analysis and mitigation plan with suppliers.
• Lead FR4/PCB quality control, failure analysis and reliability tests.
• Engage with packaging production teams during the process development from SMT, die attach, wire bond, active alignment and testing.

Required qualifications

• B.S. or M.S. in Material, Chemistry or Mechanical Engineering.
• 8+ years of working experience in FR4 substrate or PCB development or manufacturing, with in-depth knowledge in mSAP process, Any-Layer HDI process, for high-speed optical transceiver applications.
• Must be very familiar with all the equipment, typical materials and the typical process capabilities.
• Familiar with PCB layout tools such as Cadence, mechanical design tools such as Solidworks, statistical tools such as JMP.
• Working knowledge of PCB test methodologies.
• Familiar with FMEA, Control Plan, SPC, 8D, etc.
• Fluency in English to communicate with English speaking stakeholders.
• 30~50% travel in Asian countries.

Nice to have

• M.S. in Electrical or Manufacturing Engineering
• Experience with optical transceiver manufacturing process such as SMT, die attach, wire bonding and active alignment.
• Six Sigma, Statistical Analysis skills.

Benefits

• Competitive salary
• Meaningful equity in a high-growth company
• Comprehensive health, dental, and vision coverage

About the company

Lumilens is building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. It is a well-funded startup backed by Mayfield.