Signal Integrity Engineer-1.6 OSFP Board Design

The role

The Signal Integrity Engineer will own board-level high-speed electrical design for 1.6T DR8 OSFP optical modules. This includes performing pre- and post-layout simulations, defining PCB stack-up, and executing lab bring-up and validation.

What you will do

• Own SI/PI design for 1.6T DR8 OSFP module host and line-side interfaces
• Perform pre- and post-layout SI simulations for high-speed channels
• Define PCB stack-up, materials, via technology, routing rules and design constraints
• Generate SI/PI design guidelines for schematic and layout engineers
• Review schematics and layout and sign off on SI
• Collaborate with optical, mechanical, firmware and test teams on module architecture
• Plan and execute lab bring-up and correlation
• Drive SI-related root-cause debug on proto and production builds
• Contribute to technical documentation including test plans and simulation reports

Required qualifications

• B.E/B.Tech or M.E/M.Tech in Electrical/Electronics Engineering (or equivalent)
• 6–10 years of experience in high-speed board-level design/SI for networking, server or optical module products
• Strong hands-on experience with pre/post-layout SI simulations on SerDes links ≥56G using tools such as Sigrity, ADS, HFSS, SIwave, HSPICE or similar
• Proven track record defining PCB stack-ups, materials, via structures and routing rules for multi-hundred-Gbps interfaces
• Strong understanding of transmission lines, S-parameters, equalization (FFE/DFE/CTLE), jitter, crosstalk, return path design, reference plane design and power distribution networks
• Solid lab skills with high-bandwidth scopes, VNAs, BERTs and TDRs
• Experience working with cross-functional teams on complex hardware projects through multiple prototype spins
• Good written and verbal communication

Nice to have

• Experience specifically with OSFP/QSFP-DD/OSFP-XD optical transceiver modules at 800G/1.6T or similar data-center interconnect products
• Familiarity with high-speed optical components and interfaces: drivers, TIAs, CDRs/DSPs, laser/photodiode sub-assemblies, and their electrical constraints
• Exposure to relevant standards and ecosystems (e.g., IEEE 802.3 DR8/FR8/LR8-class interfaces, OIF/OTN, common management interfaces)
• Basic understanding of EMI/EMC, thermal constraints and mechanical limitations for pluggable modules

Benefits

• Competitive salary commensurate with experience
• Comprehensive benefits package including health insurance
• Professional development opportunities and certification support
• Access to cutting-edge technology and cloud platforms
• Collaborative work environment with cross-functional teams

About the company

Lumilens is building photonics infrastructure for AI supercomputing, including chip-to-chip optical interconnects and scalable photonic engines. It is a well-funded startup backed by Mayfield.