Lumilens
Senior/ Staff NPI Wafer Bumping/Fan-Out Process Engineer
Singapore. Posted 2 months ago
The role
This person will lead process development and technical support for wafer bumping and Fan-Out processes for silicon photonic chip wafers. They will design process flows, evaluate materials, and manage reliability and failure analysis.
What you will do
- Lead process development and technical support of wafer bumping and Fan-Out process
- Design and optimize early-stage process flows for wafer bumping, thin-film sputtering, lithography, electroplating, and ball drop execution
- Evaluate and qualify new manufacturing raw materials
- Design and execute DOE plans to characterize thermal and mechanical stress
- Lead reliability validations including TCT, HAST and HTS
- Own root-cause diagnostics of structural failure modes
- Utilize SEM, CSAM, and physical cross-sectioning for analytics
- Optimize key bumping process parameters to improve bump uniformity and yield
- Manage incoming wafer quality control and establish SPC control plans
- Compile process SOP, WI, process failure reports and engineering change documents
Required qualifications
- Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline
- 5+years of hands-on wafer bumping or Fan-out process integration or development experience at OSAT or IDM internal advanced packaging line
- Deep practical understanding of photolithography, wet etching, chemical vapor deposition (CVD), and physical vapor deposition (PVD), moulding process adapted for backend bump fabrication
- Comprehensive command of finite element simulation principles regarding warpage, thermal dissipation, and structural mechanical integrity
- Solid working expertise with industry validation methodologies including FMEA, SPC controls, and structured 8D problem-solving tools
- High proficiency with robust analytical platforms like JMP, Minitab, or Python
Nice to have
- Process exposure/experience on interposer, 2.5D/3D, chip on wafers on substrate
About the company
lumilens