Lumilens

Senior/ Staff NPI Wafer Bumping/Fan-Out Process Engineer

Singapore. Posted 2 months ago

The role

This person will lead process development and technical support for wafer bumping and Fan-Out processes for silicon photonic chip wafers. They will design process flows, evaluate materials, and manage reliability and failure analysis.

What you will do

  • Lead process development and technical support of wafer bumping and Fan-Out process
  • Design and optimize early-stage process flows for wafer bumping, thin-film sputtering, lithography, electroplating, and ball drop execution
  • Evaluate and qualify new manufacturing raw materials
  • Design and execute DOE plans to characterize thermal and mechanical stress
  • Lead reliability validations including TCT, HAST and HTS
  • Own root-cause diagnostics of structural failure modes
  • Utilize SEM, CSAM, and physical cross-sectioning for analytics
  • Optimize key bumping process parameters to improve bump uniformity and yield
  • Manage incoming wafer quality control and establish SPC control plans
  • Compile process SOP, WI, process failure reports and engineering change documents

Required qualifications

  • Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline
  • 5+years of hands-on wafer bumping or Fan-out process integration or development experience at OSAT or IDM internal advanced packaging line
  • Deep practical understanding of photolithography, wet etching, chemical vapor deposition (CVD), and physical vapor deposition (PVD), moulding process adapted for backend bump fabrication
  • Comprehensive command of finite element simulation principles regarding warpage, thermal dissipation, and structural mechanical integrity
  • Solid working expertise with industry validation methodologies including FMEA, SPC controls, and structured 8D problem-solving tools
  • High proficiency with robust analytical platforms like JMP, Minitab, or Python

Nice to have

  • Process exposure/experience on interposer, 2.5D/3D, chip on wafers on substrate

About the company

lumilens

Senior/ Staff NPI Wafer Bumping/Fan-Out Process Engineer at Lumilens | JobZoey