Wire Bond-Manufacturing Engineer

The role

This person will develop, qualify, optimize, and sustain wire bonding processes and equipment for semiconductor packaging operations. They will oversee ball, wedge, and ribbon bonding to ensure yield, reliability, and throughput.

What you will do

• Develop, characterize, qualify, and optimize wire bond processes for gold, copper, and aluminum wire systems
• Establish and maintain process specifications, bond recipes, work instructions, and control plans
• Lead root cause analysis and corrective/preventive actions for wire bond process yield losses and defects
• Support NPI by developing new wire bond process flows
• Perform wire pull and ball shear testing
• Drive process capability improvements and defect reduction through SPC
• Own the uptime, throughput, and performance of wire bonding equipment
• Troubleshoot and resolve equipment-related issues and optimize bonder cycle time and UPH
• Lead equipment qualification, installation, and buy-off for new or upgraded wire bonders
• Collaborate with equipment vendors for technical escalations and upgrades

Required qualifications

• Bachelor’s degree in Electrical, Mechanical, Materials Science, or related engineering
• 3–7 years’ hands-on experience in wire bond process/equipment engineering within semiconductor assembly (OSAT/IDM)
• Knowledge of ball, wedge, and/or ribbon bonding processes and failure modes
• Experience with DOE, SPC, and root cause/CAPA methods
• Familiarity with wire bond equipment platforms (ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond)
• Understanding of reliability tests and industry standards (JEDEC, MIL-STD-883)
• Strong analytical, troubleshooting, and cross-functional communication skills
• Willingness to support shift or production floor needs

Nice to have

• Experience in high-volume power semiconductor, RF/microwave, automotive, or optoelectronics packaging
• Exposure to copper wire bonding and associated process/reliability considerations
• Experience with fine-pitch wire bonding (<50 µm) and multi-tier/stacked die bonding
• Six Sigma Green/Black Belt certification
• Familiarity with statistical software (Minitab, JMP), MES/data systems, and AOI/vision systems
• Cleanroom manufacturing experience

Benefits

• Competitive salary and benefits package
• The opportunity to work on cutting-edge semiconductor packaging technology
• A collaborative, cross-functional engineering environment
• Career growth within the manufacturing/process engineering track

About the company

Lumilens is building the critical photonics infrastructure powering tomorrow’s AI supercomputing. Their mission is to unlock a new era of computing that is faster, cooler, and massively more efficient.