Lumilens
Process Engineer (Die Attach / Wire Bond / Active Alignment / Overall Line)
Bulim Square. Posted 2 months ago
The role
Process Engineers will support volume manufacturing ramp-up at the Bulim facility. You will be responsible for process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.
What you will do
- Establish process windows, parameter recipes, and standard operating procedures for assigned production modules.
- Monitor line yield metrics.
- Lead 8D root-cause failure analysis and implement corrective actions.
- Partner with NPI and Equipment Engineering to qualify new tooling, materials, and automation platforms.
- Apply SPC, DOE, FMEA, and Cpk analysis to drive process stability, cycle time reduction, and cost-efficiency.
- Work with Manufacturing Operators, Quality Engineers, and Maintenance Technicians to resolve line stops.
Required qualifications
- Bachelor’s Degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering.
- 2+ years of relevant process engineering experience in semiconductor packaging, microelectronics, surface-mount technology (SMT), or camera/optical module manufacturing.
- Experience with epoxy/eutectic dispense, high-precision pick-and-place, and flip-chip bonding OR experience with ball/wedge wire bonders and bond pull/shear testing OR experience with multi-axis optic
- Proficiency in SPC tools (JMP, Minitab).
- Proficiency in GD&T.
- Proficiency in structured problem-solving methodologies (8D, 5-Why, Fishbone).
- Willingness to work on-site at the Bulim plant and support operational needs during ramp-up phases.
Benefits
- Competitive salary and benefits
- Opportunities for career advancement
- Work with a world-class team solving cutting-edge challenges
- Collaborative and innovative work environment
About the company
Lumilens is building photonics infrastructure for AI supercomputing, including chip-to-chip optical interconnects and scalable photonic engines. It is a well-funded startup backed by Mayfield.