Senior Technical Program Manager (Silicon)

The role

The Senior Technical Program Manager will own and drive complex silicon tapeouts, advanced packaging, bring-up, validation, and system-level integration programs. This role involves end-to-end planning, scheduling, and execution for silicon and package development.

What you will do

• Organize end-to-end planning, scheduling, and day-to-day execution for silicon and package tapeouts, advanced packaging, bring-up, validation, and systems development programs.
• Partner with engineering leads and cross-functional teams to estimate, prioritize, and sequence work.
• Create, maintain, and execute detailed project plans covering scope, schedule, budget, and resources.
• Proactively manage schedules, risks, issues, and quality.
• Facilitate recurring meetings, technical reviews, and operational checkpoints.
• Deliver communications to management and stakeholders on project status, milestones, risks, and decisions.
• Provide hands-on program management and cross-functional coordination.
• Own release schedules, tapeout milestones, bring-up activities, and critical program deliverables.
• Engage with vendors, customers, and external partners on program-related activities.

Required qualifications

• 10+ years of experience in Silicon design, tapeout, bring-up, validation, and product qualification.
• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
• Solid understanding of the silicon tapeout process (verification, signoff, mask ordering, etc.).
• Experience with product bring-up, silicon validation, and qualification flows.
• Ability to influence without authority and drive results in a matrixed, cross-functional environment.
• Strong organizational skills to manage multiple priorities in a dynamic, fast-paced setting.
• Proficiency with program management tools such as MS Project, Jira, Asana, Smartsheet, or equivalent.
• Excellent written and verbal communication skills, including technical presentations.

Nice to have

• EVT/DVT exposure is a plus
• Prior background in semiconductors (chip design, physical design, or test engineering preferred)
• Strong knowledge of photonic structures, optical communication, silicon photonics, laser solutions, and heterogeneous integration
• Experience with advanced packaging technologies (2.5D/3D integration, chiplets, silicon photonics packaging, etc.)
• Experience building program management frameworks and processes from the ground up in a startup or new business unit

About the company

Lumilens is building photonics infrastructure for AI supercomputing, including chip-to-chip optical interconnects and scalable photonic engines. It is a well-funded startup backed by Mayfield.