Advanced Package Technology Principal Engineer

The role

This person will perform FEA simulations to evaluate stress, strain, warpage, and reliability risks across advanced package architectures. They will design, model, and optimize multi-chip-module architectures and flip-chip BGA packages.

What you will do

• Perform FEA simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across advanced package architectures.
• Define simulation requirements, analyse results, and deliver actionable design and process recommendations.
• Support technology road mapping by assessing new materials, interconnect structures, and process flows.
• Lead DOE studies and sensitivity analyses to identify key reliability and performance drivers.
• Collaborate with cross-functional teams to ensure robust, scalable package architectures.

Required qualifications

• Bachelor’s in Mechanical Engineering (or related field) with 12+ years FEA experience, Master’s with 10+, or PhD with 7+.
• Deep expertise in advanced packaging technologies, including flip-chip, FOWLP, 2.5D/3D integration, chiplet architectures, and TSVs.
• Strong understanding of materials behavior across polymers, metals, ceramics, and their thermo-mechanical interactions.
• Familiarity with semiconductor packaging processes such as die attach, underfill, molding, bumping, and reflow.
• Proficiency with FEA tools, including Ansys Classic/Mechanical and Abaqus.
• Ability to interpret and correlate complex simulation results using first-principles mechanical engineering concepts.
• Demonstrated experience calibrating models with empirical data, including hands-on mechanical testing and metrology.
• Proven capability in developing and running lab-level experiments to validate simulations and identify root causes.
• Strong judgment in balancing manufacturing constraints, reliability requirements, and performance needs.
• Excellent self-management, organizational discipline, and ability to thrive in a fast-moving environment.
• Comfortable collaborating with global, cross-functional engineering teams and external vendors.
• Strong presentation, communication, and technical documentation skills.

About the company

Lumilens is building photonics infrastructure for AI supercomputing. They are a well-funded startup backed by Mayfield.