Die Attach Manufacturing Engineer- Process & Equiment

The role

You will lead the development, qualification, optimization, and sustaining of die attach processes and equipment for Photonic Integrated Circuits, silicon photonics dies, and co-packaged modules. This role involves achieving sub-micron placement accuracy and managing high-precision optical/mechanical equipment.

What you will do

• Develop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies
• Establish and maintain process specifications, work instructions, control plans, and process windows
• Lead root cause analysis and implement corrective/preventive actions for die attach-related yield loss and defects
• Support NPI by developing die attach process flows for new photonic packages and modules
• Monitor SPC/process capability data on placement accuracy, bond-line thickness, and optical coupling efficiency
• Evaluate and qualify optically-compatible die attach materials
• Partner with Quality, Reliability, and Product/Optical Engineering on failure analysis and reliability testing
• Support development of active alignment processes with real-time optical feedback
• Own equipment performance, uptime, and OEE for photonics die attach tools
• Lead equipment installation, qualification, and ramp-up for new/upgraded tools

Required qualifications

• Bachelor’s degree in Electrical, Mechanical, Materials, Optical/Photonics Engineering, or related field
• 3–7 years of hands-on experience in silicon photonics/PIC industry, focusing on die attach process/equipment engineering for optical or opto-electronic packaging
• Direct experience with silicon photonics dies and/or III-V laser dies including wafer/die handling, dicing, facet protection, and optically sensitive die placement
• Working knowledge of die attach materials/methods for photonics (low-outgassing/optical-grade epoxies, UV-cure adhesives, AuSn/eutectic solder attach, flip-chip bonding) and failure modes
• Experience with high-precision die/fiber attach equipment (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or equivalent)
• Familiarity with DOE, SPC, Cpk analysis, and structured problem-solving (8D, 5-Why, Fishbone)
• Understanding of photonic packaging architectures (transceiver modules, co-packaged optics/CPO, hybrid/heterogeneous integration)
• Strong analytical, troubleshooting, and data-driven decision-making skills at sub-micron/micron-level tolerances
• Ability to read/interpret optical/mechanical engineering drawings, specs, and manuals

Nice to have

• Master's degree for senior roles
• Experience in high-volume silicon photonics, optical transceiver, or PIC foundry/packaging house
• Exposure to active alignment and optical feedback-based die bonding (real-time power monitoring)
• Experience with hermetic packaging, TECs, and laser die attach for telecom/datacom optics
• Six Sigma Green/Black Belt certification
• Experience with statistical software (Minitab, JMP) and MES/data systems
• Familiarity with automation/robotics for sub-micron precision assembly
• Cleanroom manufacturing experience

Benefits

• Competitive salary and benefits package
• Work on cutting-edge photonics packaging technology
• Collaborative, cross-functional engineering environment
• Career growth within process/manufacturing engineering

About the company

Lumilens is building the critical photonics infrastructure powering tomorrow’s AI supercomputing. Their mission is to unlock a new era of computing that is faster, cooler, and massively more efficient.