Advanced Packaging Lead

The role

You will develop assembly technologies for quantum processors in a multi-layer chip stack architecture. You will lead back-end fabrication and assembly development, define process projects, and ensure technical component integration.

What you will do

• Plan and lead development of back-end fabrication and assembly technologies.
• Enhance flip chip bonding techniques, contacts reliability, and manufacturability.
• Develop and coordinate integration test plans with cross-functional teams.
• Lead definition and formalisation of assembly-centric fabrication and process development.
• Establish scalable, well-documented integration procedures.
• Investigate and resolve integration issues and technical anomalies.

Required qualifications

• 4+ years of experience in chip assembly development of deep-tech or low-volume technology.
• Hands-on experience with back end process-flow development.
• Experience with UBM, hard-stops, bumps, detachable contacts / MEMS, flip-chip technologies.
• Background in physics, microwave/RF/electrical engineering, or a related field.

Nice to have

• Flip chip in quantum computing.
• A background in superconducting qubits.
• PhD

Benefits

• Competitive salary
• 8% holiday allowance
• Pension plan including partner and dependent coverage
• Hybrid setup
• Open vacation policy
• L&D budget

Before you apply

• Candidates may be required to undergo pre-employment screening.

About the company

QuantWare is building quantum processors using VIO technology to enable hyper-scale quantum computers.