3D Packaging Engineer

The role

You will collaborate with the engineering team to physically realize VIO products. You will operate, adapt, and fine-tune high-precision assembly equipment to meet precise tolerances.

What you will do

• Assist in modifying and calibrating high-precision assembly equipment to meet unique quantum 3D integration specifications.
• Help develop and refine placement and bonding processes for non-standard substrates.
• Test adhesives, glues, and solders to determine which materials survive extreme thermal cycling and cryogenic vacuum conditions.
• Execute complex integration strategies, including multi-die stacking, interposer-based 3D architectures, and orthogonal (vertical) chip placement.

Required qualifications

• BS, MS, or PhD in Mechanical Engineering, Mechatronics, Physics, Materials Science, or a related field.
• 3–5 years of hands-on experience operating and adjusting high-accuracy semiconductor assembly platforms.
• Demonstrated experience achieving tight placement tolerances (around 1µm) in an R&D or pilot production environment.
• Solid foundational understanding of 3D integration (TSVs, micro-bumps, interposers) and how structural materials behave under thermal stress, high vacuum, or cryogenic conditions.

Benefits

• Competitive salary
• 8% holiday allowance
• Pension that includes partner and dependent coverage
• Hybrid setup
• Open vacation policy
• L&D budget available to each team member
• Team events, offsites, and spontaneous moments

Before you apply

• Candidates may be required to undergo pre-employment screening.

About the company

QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges using unique VIO™ technology.