Signal Integrity Engineer

The role

The Signal Integrity Engineer will design, extract, and simulate complex breakout structures and board models. They will collaborate with packaging teams and ODMs to drive adoption of new interconnect technologies.

What you will do

• Design, extract, and simulate complex breakout structures.
• Perform simulation and extraction of board models for both SI and PI.
• Contribute to design and sign-off with ASIC packaging teams, ODMs, and internal layout teams.
• Create design specifications and work with external vendors.
• Drive adoption of new interconnect and packaging technologies.
• Participate in design reviews.
• Support post-silicon bring-up.
• Troubleshoot production and field failures related to signal and power integrity.
• Document design processes and provide training to team members.

Required qualifications

• Bachelor’s degree in Electrical Engineering (or equivalent)
• 5+ years working in high-speed digital design with a focus in high-speed PCB or package design at 10Gbps and above (e.g. 100GbE, GDDR6, PCIe Gen5+)
• Comfortable working with high-speed performance metrics such as ICR, ERL, COM, NEXT, and FEXT
• Knowledge of high-speed connector technologies, including NPO, CPO, and emerging standards
• Proficient with PCB ECAD tools
• Communicate clearly (written and verbal)
• Think critically

Nice to have

• ideally Cadence Allegro

Benefits

• highly competitive compensation package and benefits

Before you apply

• offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology
• offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency

About the company

Tenstorrent is leading the industry on cutting-edge AI technology. Their team has developed a high performance RISC-V CPU from scratch.