Tenstorrent
Manufacturing Engineer Packaging & OSAT
新北市, New Taipei City, Taiwan. Posted a month ago
The role
This person will own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. The role focuses on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream assembly.
What you will do
- Translate package requirements into assembly process flows, manufacturing specifications, and documentation
- Lead factory commissioning, line bring-up, pilot builds, and qualification activities
- Establish process capability and performance targets
- Use structured methods like SPC, DOE, PFMEA, 8D, and CAPA to improve results
- Own technical issue resolution and controlled change implementation across silicon, package, assembly, and test
- Work with external partners including substrate suppliers, OSATs, test houses, and contract manufacturers
Required qualifications
- 5+ years of experience in semiconductor packaging, OSAT manufacturing, assembly engineering, PCBA manufacturing, product engineering, NPI, or a closely related environment
- Experienced with semiconductor assembly, package manufacturing, package test, board assembly, final product manufacturing, or taking a process from development through sustaining operations
- Comfortable working directly with OSATs, substrate and bumping suppliers, test houses, contract manufacturers, and other external manufacturing partners
- Ability to interpret package drawings, BGA maps, BOMs, PCB data, process and quality reports, reliability results, and manufacturing documentation
Benefits
- Highly competitive compensation package and benefits
Before you apply
- Offer is contingent upon being eligible to access U.S. export-controlled technology
- May be contingent upon citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency
- Candidates will be assessed for the appropriate level during the interview process
About the company
Tenstorrent is leading the industry on cutting-edge AI technology. Their team has developed a high performance RISC-V CPU from scratch.