Expert IC Package Design Lead

The role

This person will own end-to-end IC package design from architecture through high-volume manufacturing. They will define package technologies and lead signal, power, and thermal integrity for high-performance connectivity silicon.

What you will do

• Own end-to-end IC package design from architecture through manufacturing
• Define package architecture and technology selection
• Lead signal integrity, power integrity, and thermal considerations
• Drive package layout, substrate routing, bump/ball maps, stack-ups, and materials selection
• Collaborate with silicon design, SerDes, system, SI/PI, and reliability teams
• Interface with OSATs, substrate vendors, and manufacturing partners
• Lead package-related risk assessment, failure analysis, and corrective actions
• Support NPI, qualification, and product sustainment activities

Required qualifications

• 10+ years of hands-on IC BIG package design experience for high-performance semiconductor products
• Full ownership from concept through tape-out
• Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent)
• Experience designing complex packages (BGA, FCBGA, FCCSP)
• Strong package architecture and integration expertise
• Deep understanding of signal, power, and thermal integrity at the package level
• Proven manufacturing and release experience including DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs

Nice to have

• Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces
• Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.)
• Experience supporting chiplet-based architectures and heterogeneous integration
• Prior technical leadership or package ownership on high-volume products

About the company

Astera Labs provides rack-scale AI infrastructure through purpose-built connectivity solutions. The company is establishing a strategic R&D center in Israel.