Principal IC Package Design Engineer

The role

You will lead the architecture, design, and execution of advanced packaging solutions for next-generation Ethernet switches and PHYs. This includes managing the entire package lifecycle from feasibility and architectural definition to layout, SI/PI co-design, thermal management, and mass production release.

What you will do

• Lead definition of package concepts, substrate stack-ups, bump/ball maps, and pinouts
• Execute complex, high-speed, multi-layer package layouts
• Partner with Signal/Power Integrity and Thermal engineers for co-design
• Define design rules and manage substrate layout and routing optimization
• Drive technical engagements with substrate suppliers and OSATs
• Evaluate vendor capabilities and resolve manufacturing/assembly issues
• Act as a bridge between Silicon IC Design and System/PCB teams
• Influence long-term hardware roadmap by staying at the forefront of packaging trends

Required qualifications

• B.S. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field
• 10+ years of direct experience in IC package design and architecture
• Proven track record of delivering high-volume, complex Flip-Chip BGA (FCBGA), System-in-Package (SiP), and multi-chip module (MCM) designs
• Expert proficiency in package design suites such as Cadence Allegro Package Designer (APD), SiP Layout, or Synopsys 3DIC Compiler
• Strong understanding of electromagnetic theory, transmission lines, crosstalk, and PDN concepts
• Deep understanding of substrate fabrication processes, assembly line limits, and automotive-grade reliability standards (e.g., AEC-Q100 guidelines)
• Strong problem-solving abilities with a data-driven approach to architectural trade-offs
• Excellent communication skills

Nice to have

• Familiarity with extraction tools (Ansys HFSS/Q3D, Cadence Clarity)

Benefits

• Pre IPO stock options
• Competitive base salary
• Flexible hours
• Medical, dental and vision insurance

About the company

Ethernovia is developing Ethernet-based networks for software-defined and autonomous vehicles, robotics and other intelligent machines. The company has secured $154M in total funding to date.