Head of Product Development Engineering

The role

The Head of Product Development Engineering will take products from NPI to HVM. This leader will bridge the gap between networking chip designs and high-volume, automotive-grade silicon manufacturing.

What you will do

• End-to-end product test and hardware ownership from pre-silicon to post-silicon
• Execute NPI bring-up for high-speed Ethernet switch and PHY products
• Drive the execution of the manufacturing flow from wafer starts to sample delivery
• Own test strategy across wafer test, final test and system level test
• Own characterization, ATE to system correlation, productization and manufacturing specs and margins
• Own yield improvement across process/package/test
• Drive test time and test cost reduction while meeting automotive quality requirements

Required qualifications

• Bachelor's or Master's degree in Electrical Engineering or a related technical field
• 12+ years of experience in fabless semiconductor operations, specifically for complex, high-performance SOCs or networking ICs
• Direct experience with ATE and SLT testing, characterization, ATE to system correlation, productization and silicon/package qualification
• Direct experience working with foundries, assembly houses, test houses, and OSATs in the development of high-volume products from NPI through HVM
• Expertise with iJTAG, Scan, MBIST, Sensor, SerDes, LSIO/HSIO testing on ATE, bare-metal, functional DVFS and benchmark testing at SLT and security fusing
• Experience productizing high-speed communications chips using ATE and System characterization and correlation data, balancing PPY
• Experience navigating the Automotive electronics ecosystem, including IATF 16949, ISO 26262, Safe launch and PPAP
• Experience working in fast paced start-up environment building cutting edge products
• Understanding of high-bandwidth data-path products ( Ethernet, Switching, or high-speed SerDes )
• Expert level experience with yield management systems, data analysis, scripting tools, and statistical data analysis using JMP
• Understanding of product life cycle from concept to end of life and leading pre-silicon review and readiness

Nice to have

• Familiarity with their latest FinFET process node, and QFN, LGA/BGA assembly process for automotive products
• Experience delivering high speed SerDes products to Tier-1 automotive OEMs
• Experience managing contractors and leadership experience

Benefits

• Pre IPO stock options
• Competitive base salary
• Flexible hours
• Medical, dental and vision insurance

About the company

Ethernovia is developing Ethernet-based networks for software-defined and autonomous vehicles, robotics and other intelligent machines. The company has secured $154M in total funding to date.