K2spacecorporation
Principal ASIC Physical Design Engineer
Seattle, WA. Posted 4 months ago
The role
You will lead the implementation of complex SoCs for next-generation satellite and space systems. You will own the full physical design flow from RTL handoff to GDSII and manage external physical design partners.
What you will do
- Own the complete RTL-to-GDSII flow including synthesis, floorplanning, place & route, CTS, STA, physical verification, and sign-off
- Develop and maintain physical design methodologies, scripts, and automation
- Collaborate with front-end and verification teams for timing closure and design iteration
- Drive timing closure across multiple voltage and process corners
- Partner with package, SI/PI, and test teams for package-aware floorplanning and chip-to-board integration
- Manage and technically guide external physical design partners and service vendors
- Work with EDA vendors to debug and optimize tool flows
- Support chip bring-up and debug through collaboration with post-silicon and test teams
- Support product through production and spaceflight
- Act as technical leader and subject matter expert to teach, grow, and mentor others
Required qualifications
- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field
- 10+ years of experience in ASIC physical design for high-performance SoCs
- Proven end-to-end expertise in RTL-to-GDSII flows using industry tools (Synopsys, Cadence, or Siemens)
- Strong hands-on experience with timing closure, IR drop analysis, and ECO implementation
- Deep understanding of physical design constraints for multi-clock, multi-voltage, and hierarchical SoCs
- Experience with advanced FinFET process nodes
- Prior experience managing or coordinating offshore/outsourced PD teams or vendors
- Familiarity with DFT integration, STA sign-off, and power domain implementation (UPF/CPF)
- Excellent communication, leadership, and cross-functional collaboration skills
Nice to have
- Exposure to radiation-hardened or space-qualified ASICs
- Experience with chip-package co-design or advanced packaging (2.5D/3D)
- Familiarity with physical design service vendor management or offshore collaboration
- Experience driving tapeouts through TSMC
- Experience with Gate-All-Around technologies
- Experience working in cross-functional, geographically distributed teams
Benefits
- Paid time off
- Medical/dental/vision coverage
- Life insurance
- Paid parental leave
- Many other perks
Before you apply
- Must be a U.S. person as defined by 22 C.F.R. § 120.15 or otherwise eligible for a federally issued export control license
About the company
K2 is building the largest and highest-power satellites ever flown for missions from LEO to deep space. The company is mass-producing high-power satellite platforms and is a high-growth Series D-funded company.