K2spacecorporation

Principal ASIC Physical Design Engineer

Seattle, WA. Posted 4 months ago

The role

You will lead the implementation of complex SoCs for next-generation satellite and space systems. You will own the full physical design flow from RTL handoff to GDSII and manage external physical design partners.

What you will do

  • Own the complete RTL-to-GDSII flow including synthesis, floorplanning, place & route, CTS, STA, physical verification, and sign-off
  • Develop and maintain physical design methodologies, scripts, and automation
  • Collaborate with front-end and verification teams for timing closure and design iteration
  • Drive timing closure across multiple voltage and process corners
  • Partner with package, SI/PI, and test teams for package-aware floorplanning and chip-to-board integration
  • Manage and technically guide external physical design partners and service vendors
  • Work with EDA vendors to debug and optimize tool flows
  • Support chip bring-up and debug through collaboration with post-silicon and test teams
  • Support product through production and spaceflight
  • Act as technical leader and subject matter expert to teach, grow, and mentor others

Required qualifications

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field
  • 10+ years of experience in ASIC physical design for high-performance SoCs
  • Proven end-to-end expertise in RTL-to-GDSII flows using industry tools (Synopsys, Cadence, or Siemens)
  • Strong hands-on experience with timing closure, IR drop analysis, and ECO implementation
  • Deep understanding of physical design constraints for multi-clock, multi-voltage, and hierarchical SoCs
  • Experience with advanced FinFET process nodes
  • Prior experience managing or coordinating offshore/outsourced PD teams or vendors
  • Familiarity with DFT integration, STA sign-off, and power domain implementation (UPF/CPF)
  • Excellent communication, leadership, and cross-functional collaboration skills

Nice to have

  • Exposure to radiation-hardened or space-qualified ASICs
  • Experience with chip-package co-design or advanced packaging (2.5D/3D)
  • Familiarity with physical design service vendor management or offshore collaboration
  • Experience driving tapeouts through TSMC
  • Experience with Gate-All-Around technologies
  • Experience working in cross-functional, geographically distributed teams

Benefits

  • Paid time off
  • Medical/dental/vision coverage
  • Life insurance
  • Paid parental leave
  • Many other perks

Before you apply

  • Must be a U.S. person as defined by 22 C.F.R. § 120.15 or otherwise eligible for a federally issued export control license

About the company

K2 is building the largest and highest-power satellites ever flown for missions from LEO to deep space. The company is mass-producing high-power satellite platforms and is a high-growth Series D-funded company.

Principal ASIC Physical Design Engineer at K2spacecorporation | JobZoey