Principal ASIC Package Design Engineer

The role

You will lead advanced ASIC package architecture and execution for high-performance mixed-signal and digital SoCs. This includes managing end-to-end package strategy from early architecture through vendor engagement and production ramp.

What you will do

• Own ASIC package architecture for FC-BGA and MCM solutions.
• Lead package-level trade studies across cost, performance, power integrity, signal integrity, thermal, manufacturability, and reliability.
• Define long-term packaging roadmap.
• Establish organizational package design standards, methodologies, and best practices.
• Drive detailed design of FC-BGA packages for high-pin-count ASICs.
• Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
• Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.
• Own package-level SI/PI strategy.
• Lead thermal architecture at the package level.
• Manage relationships with external packaging vendors, substrate suppliers, and OSATs.

Required qualifications

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
• 10+ years of experience in ASIC package design, with deep expertise in FC-BGA.
• Proven experience delivering high-pin-count, high-performance ASIC packages into production.
• Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
• Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
• Experience working directly with OSATs and substrate vendors.
• Knowledge of packaging qualification and test methodologies.

Nice to have

• Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates).
• Background in high-speed digital or mixed-signal SoCs.
• Familiarity with aerospace, space, or high-reliability electronics.
• Experience defining packaging strategy from early architecture through first silicon and volume ramp.
• Demonstrated history of building or scaling package design methodology within an organization.

Benefits

• Paid time off
• Medical/dental/vision coverage
• Life insurance
• Paid parental leave
• Many other perks

Before you apply

• Must be a U.S. person as defined by 22 C.F.R. § 120.15 or otherwise eligible for a federally issued export control license.

About the company

K2 is building the largest and highest-power satellites ever flown for missions from LEO to deep space. The company is mass-producing high-power satellite platforms and is a high-growth Series D-funded company.