Senior Optical Packaging & Assembly Engineer

The role

The Senior Optical Packaging Engineer will develop and implement high-performance, robust, and scalable opto-electronic packaging workflows for chip-based photonic integrated circuits. This work is carried out in the UK R&D facility.

What you will do

• Develop an optical package and fibre-to-chip alignment scheme for high alignment accuracy and scalable assembly.
• Help develop packaging prototypes and scalable fibre-to-chip packaging flows and processes.
• Review packaging design BOMs.
• Work with supply chain on procuring parts needed for assembly.
• Work with internal packaging team and external vendors on transferring and scaling packaging designs and processes.
• Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements.
• Work with external partners to develop advanced opto-electronic packaging solutions.

Required qualifications

• Master’s Degree or above in Optical Engineering, Physics or equivalent.
• 3+ years of experience working on PIC packaging design & qualification.
• 5+ years of experience working with optical fibers, optical measurements.
• 3+ years of experience working on FAU / optical connector to chip attachment.
• Experience with optical data analysis.

About the company

PsiQuantum's mission is to build the first useful quantum computers using an architecture based on silicon photonics. The company develops algorithms and software to make these systems commercially valuable.